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Materials for Flexible Printed Wiring Boards

Materials for Flexible Printed Wiring Boards


NIKKAN was one of the first companies to focus on thin, light flexiblewiring boards suitable for lighter and smaller electronic devices, and became .lapanl s first manufacturer to succeed in mass-producing materials for flexible printed wiring boards. Since then, the excellent quality of our products has been recognized throughout the world.

Products

NIKAFLEX® - Copper Clad Laminate for Flexible Printed Circuits　F-series

F-series：It is copper clad laminates material for flexible printed circuits. Film and copper are
laminated by insulation adhesive. According to customers’ demand, different compositions are
available(various polyimide film, various copper, various adhesive)

Application： mobile device, automotive, camera, electronic components etc.

F-series code meaning
F-30VC1 / F-30VC2

Polyimide film base copper clad laminate for flexible printed circuits (halogen contained)

F-50VC1 / F-50VC2

High insulation reliability polyimide film base copper clad laminate for flexible printed circuits (halogen contained)

NIKAFLEX® - Coverlay film for Flexible Printed Circuits　C-series

C-series：They are material for flexible printed circuits Functional adhesive is coated on one side
of polymidefilm and separator is laminated. They are used according to high heat resistance,
high insulation reliability,low DK characteristic and application. Ultra-thin base polymide film
from 5μm is available.

Application：mobile device, automotive, camera, electronic components etc.

C-series code meaning
C IS V

Polymide film base coverlay for general purpose (halogen contained)

C IS A

High insulation reliability polymide film base coverlay (halogen contained)

C KS E

Halogen free polyminde film base coverlay for general purpose

C NS F

High insulation reliability halogen free polymide film base coverlay

C IS G

High Tg・High insulation reliability halogen free polymide film base coverlay

C NS Y

Low Dk・low Df halogen free polymide film base coverlay

NIKAFLEX® - Bonding Sheet　SA-series

SA-series：They are bonding sheets with separator. They are currently used in bonding purpose for flexible printed circuits and electronic components.
They have excellent adhesion to various kinds of material. They are used according to insulation reliability, low DK characteristic and high thermal conductivity purpose.

Applications：stiffener , multilayer board, electronic components , metal components 　

SA-series code meaning
SA FW

High tack bonding sheet for stiffener

SA FA

High insulation reliability bonding sheet

SA FV

Bonding sheet for general purpose

SA FG

Halogen free high Tg bonding sheet

SA FP

Halogen free bonding sheet for multilayer FPC

SA FN

Halogen free high adhesion bonding sheet

SA FY

Halogen free low DK bonding sheet

SA FU

Halogen free thermal conductive white bonding sheet

Introduction to NIKKAN Departments（Laminated Products Department）

The Laminated Products Department handles materials for flexible wiring boards that are suitable for downsizing and higher performance of electronic devices since they are thin and light, and more importantly, flexible. The product lineups include copper-clad laminates (CCL) for flexible wiring boards, cover layers (CL) and adhesive sheets as well as rigid-flexible compatible materials, a combination of FPC and rigid boards, thus allowing us to meet diversified user needs. All of these products are manufactured at our production subsidiary Takahagi Nikkan Co., Ltd., which has acquired ISO9001 certification, to ensure a structure to provide high-quality products.

Information

Laminated Products Department
Tel: 03-3723-9853 / e-mail: fcm@nikkan-ind.co.jp

Osaka Seles Office
Tel: 06-6150-2811

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