-
For reduction the transmission loss, impedance matching
Low Dielectric constant, Low Dissipation factor Coverlay and bonding sheet
Low Dk/Df materials for high frequency design. High adhesive strength with LCP film, and can be cure by press on 160 degree C.
Use cases:
Flexible high speed transmission circuit -
For bonding between gap cannot be applied pressure
Foaming adhesive sheet
Available to fill the gap and adhesion by changing its own thickness by foaming with heat. It has heat resistance, heat shock cycle resistance and ATF oil resistance.
Use cases:
Fixing of permanent magnetic for IPM motor
Vehicle-mounted items or more -
Clear and colorless
High Transparency・Low temperature curing adhesive shseet
This adhesive sheet has Transparent,colorless, thermosetting that can be
cured at temperatures as low as 70℃.Compared to OCA, it has superior
reliability and step-following properties.■Application
Display, AR glasses etc -
We proposed that our new material has some properties which are uniquely flexible and high in tracking to a cultured cell sheet
ATTRAN®
Our new product has been created by applying special polymer on the polylactic acid non-woven fabric.
Thus it is uniquely flexible and high in tracking to a cultured cell sheet and the affected body part.
* Adoption results:
・St. Marianna University
・Other research institutions for Cultured Cell
