Home > News > 2010


June / 2010

Nikkan Industries participated in the 40th International Electronic Circuits Expo (JPCA SHOW 2010) held at the Tokyo International Exhibition Center (Tokyo Big Site) over the three days from June 2 to June 4, 2010. With the ultimate aim of creating appeal for its core coating, adhesive and laminating technologies exhibits in the booth, brightly illuminated with LED lights, included electromagnetic wave shielding sheets and thick, copper clad laminates. Visitors to the booth showed interest in the white coverlay films, electromagnetic wave shielding materials, aluminum boards and copper core boards, and the variety of laminate materials, with the LED lit sample exhibits drawing an enthusiastic response.


top of pagetop of page