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July / 2009

Nikkan Industries participated in the 39th International Electronic Circuits Expo (JPCA SHOW 2009) held at the Tokyo International Exhibition Center (Tokyo Big Site) over the three days from June 3 to June 5, 2009. A booth was set up in the electronic circuits area to create maximum appeal for our core coating, adhesive and laminating technologies and products. Visitors to the booth showed a particular interest in our photosensitive coverlays for flexible printed wiring boards, heat-resistant materials displayed by our laminating department and a newly developed product, polyimide sheets.



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