June / 2007
We participated in the 37th JPCA Show at Tokyo Big Sight from May 30 to June 1, 2007. With the aim to disseminate Nikkanfs environmental technologies internationally, our booth was divided into five compartments in the FPC exhibition area of the JPCA Show. The most popular products by type, according to the level of interest of the visitors, were halogen-free materials (flexible materials division), highly heat-resistant materials (laminate division) and mounting jigs (development).
January / 2007
From January 17 (Wednesday) through January 19 (Friday), 2007, the 36th INTERNEPCON JAPAN was held. As with the last year’s event, NIKKAN Industries participated in the “8th PRINTED WIRING BOARDS EXPO”. The NIKKAN booth presented exhibits mainly focused on halogen-free materials, new high Tg materials (F-77V, CKSG and SAFG) and reinforcing sheets with low particle generation (L-6555 and L-6527). At the sub-materials section, we displayed materials for PCB/FPC carriers as newly developed products, as well as newly developed carrier plate (L-6706W) with whitish-gray color that supports easier image processing by CCD camera. We also exhibited examples using NIKKAN materials, such as a driver for PDP, a HDD built in a camera and its rigid-flex board, a rigid-flex board for mobile phones and a board for iPod nano, to attract interest from visitors.
